Semiconductor Chipping Improvement via a Full Sandwich Wafer Mounting Technique.
| Autor: | Amri, Mohd Syahrin1,2 syahrin@utem.edu.my, Omar, Ghazali1,2 ghazali@utem.edu.my, Mispan, Mohd Syafiq3 syahrin@utem.edu.my, Harun, Fuaida4 ghazali@utem.edu.my, Mustafa, Zaleha5 syafiq.mispan@utem.edu.my |
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| Zdroj: | Majlesi Journal of Electrical Engineering. Mar2024, Vol. 18 Issue 1, p145-163. 19p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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