A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.

Autor: Huang, Jeng-Hau1 (AUTHOR) f07527007@ntu.edu.tw, Shih, Po-Shao1 (AUTHOR) f08527055@ntu.edu.tw, Renganathan, Vengudusamy1 (AUTHOR) renganathank.v.r@gmail.com, Gräfner, Simon Johannes1 (AUTHOR) sim.gra@hotmail.de, Lin, Yu-Chun1 (AUTHOR) typs94040@gmail.com, Kao, Chin-Li2 (AUTHOR) golden_kao@aseglobal.com, Lin, Yung-Sheng2 (AUTHOR) viktor_lin@aseglobal.com, Hung, Yun-Ching2 (AUTHOR) megan_hung@aseglobal.com, Kao, Chengheng Robert1 (AUTHOR) crkao@ntu.edu.tw
Zdroj: Materials (1996-1944). Apr2024, Vol. 17 Issue 7, p1638. 14p.
Databáze: Academic Search Ultimate
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