Interface stress analysis and bonding strengthening exploration of metal layer on the laser-activated copper-clad AlN.

Autor:	Shao, Jing1 (AUTHOR) qunying12@163.com, Wang, Yingming1 (AUTHOR), Zhu, Karl2 (AUTHOR), Sun, Zhiyuan3 (AUTHOR), Han, Suli1 (AUTHOR), Dong, Hao1 (AUTHOR), Sun, Shufeng1 (AUTHOR), Song, Ping4 (AUTHOR), Zhang, Ruolan5 (AUTHOR)
Zdroj:	Microelectronics Reliability. Apr2024, Vol. 155, pN.PAG-N.PAG. 1p.
Databáze:	Academic Search Ultimate
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect