Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor.

Autor:	Tian, Xu1 (AUTHOR), Ding, Yuancan1 (AUTHOR), Chai, Gaoda2 (AUTHOR) chaigaoda@huawei.com, Tang, Yupu1 (AUTHOR), Lei, Renbo1 (AUTHOR), Jia, Guodong2 (AUTHOR), Zhang, Yuanju1 (AUTHOR), Li, Jinxiong1 (AUTHOR), Zhou, Yi1 (AUTHOR), Wang, Xinwei1,3 (AUTHOR) wangxw@pkusz.edu.cn
Zdroj:	Advanced Materials Technologies. Feb2024, Vol. 9 Issue 4, p1-9. 9p.
Databáze:	Academic Search Ultimate
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