ISTFA 2023 SYSTEM IN PACKAGE (SIP) USER GROUP.
| Autor: | Yan Li yan.a.li@samsung.com, Tracy, Bryan btracy@tesla.com, Wentao Qin wentao.qin@microchip.com |
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| Zdroj: | Electronic Device Failure Analysis. Feb2024, Vol. 26 Issue 1, p42-43. 2p. |
| Databáze: | Academic Search Ultimate |
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