THERMAL MODELLING AND ANALYSIS OF 3-D INTEGRATED CIRCUITS WITH IRREGULAR STRUCTURE.
| Autor: | Xixin RAO1, Huizhong LIU1, Sai WANG2, Jianhao SONG1, Cheng JIN1, Chengdi XIAO1,3 xcd0719@ncu.edu.cn |
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| Zdroj: | Thermal Science. 2023, Vol. 27 Issue 5B, p4193-4207. 15p. |
| Databáze: | Academic Search Ultimate |
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