Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications.
| Autor: | Lyon, Benjamin1 bejaminbpl@vt.edu, DiMarino, Christina1 |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2023, Vol. 20 Issue 3, p89-94. 6p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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