Effect of P Content on the Microstructure and Mechanical Properties of Cu-P-Sn-Ag Quaternary Alloy Solder.
| Autor: | LI Hang1, ZHANG Shuting1, TANG Weigang2, OUYANG Peixuan1, LUO Liangliang2, WEN Yi1 |
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| Zdroj: | Nonferrous Metals Engineering. Oct2023, Vol. 13 Issue 10, p22-29. 8p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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