Facile and flexible fabrication of structured array surfaces on binderless tungsten carbide by using electrical discharge machining with a novel self‐assembly ball electrode.
Autor: | Li, Kangsen1,2 (AUTHOR), Wang, Chunjin1 (AUTHOR) chunjin.wang@polyu.edu.hk, Gong, Feng2 (AUTHOR), Cheung, Chi Fai1 (AUTHOR) benny.cheung@polyu.edu.hk |
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Zdroj: | Journal of the American Ceramic Society. Dec2023, Vol. 106 Issue 12, p7386-7399. 14p. |
Databáze: | Academic Search Ultimate |
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