Material removal rate prediction and surface quality study for ultrasonic vibration polishing of monocrystalline silicon.

Autor: Qu, Sheng1,2,3 (AUTHOR), Yu, Tao1 (AUTHOR), Meng, Fanwei1,2,3 (AUTHOR), Zhang, Chao1,2,3 (AUTHOR), Zhang, Xuewei1,2,3 (AUTHOR), Ma, Zhelun1,2,3 (AUTHOR), Wang, Zixuan1,2,3 (AUTHOR), Yu, Tianbiao1,2,3 (AUTHOR) tianbiaoyuneu@163.com, Zhao, Ji1,2,3 (AUTHOR) jzhao@mail.neu.edu.cn
Zdroj: International Journal of Advanced Manufacturing Technology. Aug2023, Vol. 127 Issue 9/10, p4789-4802. 14p.
Databáze: Academic Search Ultimate
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