Calculation of the current density distribution of submicron copper electroplating based on uneven adsorption of poly(ethylene glycol).
| Autor: | Bang-Hao Wu1, Chi-Chao Wan1 ccwan@mx.nthu.edu.tw, Yung-Yun Wang1 |
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| Zdroj: | Journal of Applied Electrochemistry. Mar2005, Vol. 35 Issue 3, p305-310. 6p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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