Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.
| Autor: | Hu Zhen1 leslie.hu@jcetglobal.com, Zhao Wei1, Gu Xiao1, Chen Dong1, Chen Haijie1, Xu Hong1, Kim Hwee Tan1 |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2022, Vol. 19 Issue 3, p89-94. 6p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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