ISTFA 2022 SYSTEM ON PACKAGE USER GROUP.
| Autor: | Tracy, Bryan btracy@tesla.com, Distelhurst, Kevin kevin.distelhurst@globalfoundries.com, Lihong Cao lihong.cao@aseus.com, Wentao Qin wentao.qin@onsemi.com |
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| Zdroj: | Electronic Device Failure Analysis. Feb2023, Vol. 25 Issue 1, p40-40. 3/4p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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