Lithography-Based Surface Modification of Copper for Soldering Application.
| Autor: | MAHAYUDDIN, N. A. H. M.1, WAHAB, J. A.1 juyana@unimap.edu.my, SALLEH, M. A. M.1, NAZERI, M. F. M.1, POSTAWA, P.2, NABIAŁEK, M.3, JEZ, B.2, GARUS, J.4 |
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| Zdroj: | Acta Physica Polonica: A. Jul2022, Vol. 142 Issue 1, p74-76. 3p. |
| Databáze: | Academic Search Ultimate |
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