HIGH SPEED X-RAY TOMOGRAPHY WITH SUBMICRON RESOLUTION FOR FA AND REVERSE ENGINEERING OF PACKAGES, PCBs, AND 300 mm WAFERS.
| Autor: | Lau, S. H.1 shlau@sigray.com, Gul, Sheraz1, Gelb, Jeff1, Tianzhu Qin1, Guibin Zan2, Matusik, Katie1, Vine, David1, Lewis, Sylvia1, Wenbing Yun1 |
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| Zdroj: | Electronic Device Failure Analysis. Aug2022, Vol. 24 Issue 3, p32-40. 7p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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