EXPERIMENTAL INVESTIGATION OF THE EMBEDDED MICRO-CHANNEL MANIFOLD COOLING FOR POWER CHIPS.
| Autor: | Nan ZHANG1,2, Ruiwen LIU2, Yanmei KONG2, Yuxin YE2, Xiangbin DU2, Bo CONG2, Lihang YU2, Zhiqiang WANG3, Yang DAI3, Wei LI3, Binbin JIAO2 jiaobinb@ime.ac.cn, Zhiyong DUAN1 duanzhiyong@zzu.edu.cn |
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| Zdroj: | Thermal Science. 2022, Vol. 26 Issue 2B, p1531-1543. 13p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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