Effect of critical properties of epoxy molding compound on warpage prediction: A critical review.
Autor: | Phansalkar, Sukrut Prashant1 (AUTHOR), Kim, Changsu1 (AUTHOR), Han, Bongtae1 (AUTHOR) bthan@umd.edu |
---|---|
Zdroj: | Microelectronics Reliability. Mar2022, Vol. 130, pN.PAG-N.PAG. 1p. |
Databáze: | Academic Search Ultimate |
Externí odkaz: |