Effect of critical properties of epoxy molding compound on warpage prediction: A critical review.

Autor:	Phansalkar, Sukrut Prashant1 (AUTHOR), Kim, Changsu1 (AUTHOR), Han, Bongtae1 (AUTHOR) bthan@umd.edu
Zdroj:	Microelectronics Reliability. Mar2022, Vol. 130, pN.PAG-N.PAG. 1p.
Databáze:	Academic Search Ultimate
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect