Three-Dimensional TID Hardening Design for 14 nm Node SOI FinFETs.
| Autor: | Peng Lu1 lupeng@ime.ac.cn, Can Yang1 yangcan@ime.ac.cn, Yifei Li1 liyifei@ime.ac.cn, Bo Li1 libo3@ime.ac.cn, Zhengsheng Han1 zshan@ime.ac.cn |
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| Zdroj: | Eng. Dec2021, Vol. 2 Issue 4, p620-631. 12p. |
| Databáze: | Academic Search Ultimate |
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