The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure.
| Autor: | Gomatam, Rajesh R.1, Sancaktar, Erol2 erol@uakron.edu |
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| Zdroj: | Journal of Adhesion Science & Technology. 10/1/2004, Vol. 18 Issue 11, p1245-1261. 17p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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