Thermally resistant and strong remoldable triple-shape memory thermosets based on bismaleimide with transesterification.

Autor: Ning, Lijian1 (AUTHOR), Yuan, Li1 (AUTHOR), Liang, Guozheng1 (AUTHOR) lgzheng@suda.edu.cn, Gu, Aijuan1 (AUTHOR) ajgu@suda.edu.cn
Zdroj: Journal of Materials Science. Feb2021, Vol. 56 Issue 4, p3623-3637. 15p. 4 Diagrams, 3 Charts, 10 Graphs.
Databáze: Academic Search Ultimate
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