Soldering of 7075 Aluminum Alloy Using Ni-P and Cu-Cr Electrodeposited Interlayers.
| Autor: | Mirski, Zbigniew1 (AUTHOR) zbigniew.mirski@pwr.edu.pl, Ciepacz, Ireneusz2 (AUTHOR) iciepacz@o2.pl, Wojdat, Tomasz1 (AUTHOR) tomasz.wojdat@pwr.edu.pl |
|---|---|
| Zdroj: | Materials (1996-1944). Sep2020, Vol. 13 Issue 18, p4100. 1p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
|