DEFECT CHARACTERIZATION OF ADVANCED PACKAGES USING NOVEL PHASE AND DARK FIELD X-RAY IMAGING.
| Autor: | Lau, S. H.1 shlau@sigray.com, Gul, Sheraz1, Guibin Zan1, Vine, David1, Lewis, Sylvia1, Wenbing Yun1 |
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| Zdroj: | Electronic Device Failure Analysis. Aug2020, Vol. 22 Issue 3, p18-25. 8p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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