THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.
| Autor: | Peng XU1, Zhong-Liang PAN1 panzhongliang@m.scnu.edu.cn |
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| Zdroj: | Thermal Science. 2020, Vol. 24 Issue 3B, p2067-2075. 9p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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