Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials.

Autor: Shim, Jaewoo1,2 (AUTHOR), Bae, Sang-Hoon1,2 (AUTHOR), Wei Kong1,2 (AUTHOR), Doyoon Lee1,2 (AUTHOR), Kuan Qiao1,2 (AUTHOR), Nezich, Daniel3 (AUTHOR), Yong Ju Park4 (AUTHOR), Zhao, Ruike1,5 (AUTHOR), Sundaram, Suresh6 (AUTHOR), Xin Li6 (AUTHOR), Yeon, Hanwool1,2 (AUTHOR), Choi, Chanyeol1,2 (AUTHOR), Hyun Kum1,2 (AUTHOR), Yue, Ruoyu7 (AUTHOR), Guanyu Zhou7 (AUTHOR), Yunbo Ou8 (AUTHOR), Kyusang Lee1,2,9 (AUTHOR), Moodera, Jagadeesh8 (AUTHOR), Xuanhe Zhao1 (AUTHOR), Ahn, Jong-Hyun4 (AUTHOR)
Zdroj: Science. 11/9/2018, Vol. 362 Issue 6415, p665-670. 6p. 1 Color Photograph.
Databáze: Academic Search Ultimate
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