Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures.
| Autor: | Gomatam, Rajesh R.1, Sancaktar, Erol2 erol@uakron.edu |
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| Zdroj: | Journal of Adhesion Science & Technology. 8/1/2004, Vol. 18 Issue 8, p849-881. 33p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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