THERMAL MANAGEMENT OF THE HOTSPOTS IN 3-D INTEGRATED CIRCUITS.

Autor: Kang-Jia Wang1 konka05@163.com, Hong-Chang Sun2,3 kk121618@163.com, Cui-Ling Li4, Guo-Dong Wang1, Hong-Wei Zhu1
Zdroj: Thermal Science. 2018, Vol. 22 Issue 4, p1685-1690. 6p.
Databáze: Academic Search Ultimate