Use of Wafer Applied Underfill for 3D Stacking.
| Autor: | La Manna, Antonio1 Antonio.lamanna@imec.be, Rebibis, K. J.1, Gerets, C.1, Beyne, E.1 |
|---|---|
| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2012 1st Quarter, Vol. 9 Issue 1, p10-18. 9p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
|