Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.
| Autor: | Burkhardt, T.1,2 Thomas.Burkhardt@iof.fraunhofer.de, Hornaff, M.1, Acker, A.1, Peschel, T.1, Beckert, E.1, Suphan, K.-H.3, Mensel, K.4, Jirak, S.4, Eberhardt, R.1, Tünnermann, A.1,2 |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2012 3rd Quarter, Vol. 9 Issue 3, p113-119. 7p. |
| Databáze: | Academic Search Ultimate |
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