Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs.
| Autor: | Kostka, Darryl1 darryl.kostka@cst.com, Scogna, Antonio Ciccomancini1 |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2012 2nd Quarter, Vol. 9 Issue 2, p52-64. 13p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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