Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis.
| Autor: | Kuo-Tsai Wu1 n18991194@mail.ncku.edu.tw, Sheng-Jye Hwang1 jimppl@mail.ncku.edu.tw, Huei-Huang Lee2 hhlee@mail.ncku.edu.tw |
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| Zdroj: | Sensors (14248220). Jun2017, Vol. 17 Issue 6, p1392. 17p. |
| Databáze: | Academic Search Ultimate |
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