Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling.
| Autor: | Chaobo Shen1 czs0037@auburn.edu, Zhou Hai1 jhai@nvidia.com, Cong Zhao1 czz0025@auburn.edu, Jiawei Zhang1 zhangjiawei19831010@gmail.com, Evans, John L.1 evansjl@auburn.edu, Bozack, Michael J.1 bozacmj@auburn.edu, Suhling, Jeffrey C.1 jsuhling@auburn.edu |
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| Zdroj: | Materials (1996-1944). May2017, Vol. 10 Issue 5, p451. 14p. 4 Color Photographs, 4 Diagrams, 3 Charts, 6 Graphs. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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