The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer.
| Autor: | Seal, Sayan1 seal@uark.edu, Glover, Michael D.1,2, Mantooth, H. Alan1 |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2016 4th Quarter, Vol. 13 Issue 4, p169-175. 7p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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