A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology.

Autor: Murray, Todd W.1 todd.murray@colorado.edu, Bakir, Andrew1, Stobbe, David M.1, Kotelyanskii, Michael J.2, Mair, Robin A.2, Mehendale, Manjusha2, Xueping Ru2, Cohen, Jonathan D.2, Schulberg, Michelle T.3, Mukundhan, Priya2, Kryman, Timothy J.2
Zdroj: Journal of Microelectronic & Electronic Packaging. 2016 2nd Quarter, Vol. 13 Issue 2, p58-63. 6p.
Databáze: Academic Search Ultimate