The effect of dry friction forces on the process of dielectric wafer grinding.
| Autor: | Igumnov, L. A.1 igumnov@mech.unn.ru, Metrikin, V. S.1 v.s.metrikin@mail.ru, Grezina, A. V.2 alekcandra-grezina@yandex.ru, Panasenko, A. G.2 a.g.panasenko@yandex.ru |
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| Zdroj: | Vibroengineering Procedia. Oct2016, Vol. 8, p501-505. 5p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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