Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips.
| Autor: | Shuang-Tao Feng1,2 13207567335@163.com, Yun-Hui Mei1,2 yunhui@tju.edu.cn, Gang Chen3 agang@tju.edu.cn, Xin Li1,2 xinli@tju.edu.cn, Guo-Quan Lu1,4 gqlu@vt.edu |
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| Zdroj: | Materials (1996-1944). Jul2016, Vol. 9 Issue 7, p564. 17p. 1 Color Photograph, 1 Diagram, 2 Charts, 6 Graphs. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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