Effect of In Addition on Thermophysical Properties of Sn-9Zn-In/Cu Solder.
| Autor: | YI-TA WANG1 ytwang@niu.edu.tw, CHENG JEN HO2 |
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| Zdroj: | International Journal of Transport Phenomena. 2015, Vol. 14 Issue 1, p53-59. 7p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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