Ternary intermetallic compounds in Au-Sn soldering systems-structure and properties.
| Autor: | Müller, Carola1 carola.muller@chem.lu.se, Bushlya, Volodymyr2, Ghasemi, Masoomeh3, Lidin, Sven1, Valldor, Martin, Wang, Fei1 |
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| Zdroj: | Journal of Materials Science. Dec2015, Vol. 50 Issue 23, p7808-7820. 13p. 1 Black and White Photograph, 3 Diagrams, 5 Charts, 13 Graphs. |
| Databáze: | Academic Search Ultimate |
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