Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly.

Autor: Sungbum Kang1, Charles Ume, I.1 charles.ume@me.gatech.edu
Zdroj: Journal of Microelectronic & Electronic Packaging. 2015, Vol. 12 Issue 2, p104-110. 7p.
Databáze: Academic Search Ultimate