Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly.
Autor: | Sungbum Kang1, Charles Ume, I.1 charles.ume@me.gatech.edu |
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Zdroj: | Journal of Microelectronic & Electronic Packaging. 2015, Vol. 12 Issue 2, p104-110. 7p. |
Databáze: | Academic Search Ultimate |
Externí odkaz: |