A Study of Parameters Related to the Etch Rate for a Dry Etch Process Using NF3/O2 and SF6/O2.
Autor: | Seon-Geun Oh1, Kwang-Su Park1, Young-Jun Lee1, Jae-Hong Jeon1, Hee-Hwan Choe1 choehh@kau.ac.kr, Jong-Hyun Seo2 |
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Zdroj: | Advances in Materials Science & Engineering. 2014, p1-8. 8p. |
Databáze: | Academic Search Ultimate |
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