| Autor: |
S.H. Hu1,2 shaohwa@ms01.dahan.edu.tw, J.Y. Wu1,3, F.S. Yen1, M.S. Tsai1 |
| Předmět: |
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| Zdroj: |
Environmental Progress. Oct2006, Vol. 25 Issue 3, p242-250. 9p. 1 Diagram, 6 Charts, 7 Graphs. |
| Abstrakt: |
The article describes the development of a treatment procedure for processing aluminum-contaminated sludge produced from the coagulation/floculation process of wastewater treatment in the manufacture of printed circuit boards. Metals such as zinc, nickel and chromium have been shown to appear in smaller concentrations and come from copper foil in the etching process. |
| Databáze: |
GreenFILE |
| Externí odkaz: |
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