| Abstrakt: |
The electronics industry has relied on lead-tin solder to attach electronic components to printed wiring boards. However, new European regulations state that by July 2006 lead in electronics equipment must be replaced by other substances. Researchers are now exploring two promising substitutes. One is the use of alternative alloys, the most popular being a formulation of tin, silver, and copper. The other is the use of electrically conductive adhesives, polymers such as silicone or polyamide that contain tiny flakes of metals. Both innovations have potential environmental ramifications, however, and their developers are still refining them. [ABSTRACT FROM AUTHOR] |
