Power electronic interconnects : frequency selective electromagnetic propagation
| Autor: | Van Wyk, Jacobus Daniel, Jr. |
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| Rok vydání: | 2012 |
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| Druh dokumentu: | Diplomová práce |
| Popis: | D.Ing. The necessity of frequency selective interconnects in future integrated power electronic systems are highlighted. A brief historical background illustrates that such interconnects have been utilized successfully in other fields of electrical engineering, although based on different high frequency effects, and configurations. Based on high frequency characteristics of typical interconnects, it is hypothesized that the required frequency selectivity could be obtained through utilization of the skin- and proximity effect, and low conductivity materials, to increase high frequency resistance significantly. Finite element simulation results for a large number of interconnects, and reference structures, are presented in an effort to identify relevant parameters and mechanisms. A hybrid lumped / distributed parameter impedance model is proposed. Parametric analysis is conducted to determine limitations and constraints of the proposed technique. Frequency selective damping of turn-off related power electronic switch and interconnect inductance resonance, is investigated as a possible application of such higher resistance. A simplified analytical model is proposed, and utilized to calculate turn-off waveforms and percentages of damping. An approximation of maximum damping possible is presented. Utilization of enhanced high frequency resistance to realize interconnect based low pass filters for medium power integrated power electronic modules, is investigated as a second application. Based on typical parameter influence, a number of structures are evaluated with finite element simulations. An analytical, lossy transmission line model is developed. Parametric analysis for a chosen structure is conducted, followed by discussion of maximum attenuation, and relative effectiveness. As a third application, the above concepts are applied to 1.5kA nominal current interconnects. A number of structures are evaluated. Application of consecutive impedance mismatches to increase attenuation is investigated. Current and voltage capacity constraints are discussed. Experimental verification of the presented concepts in general, are presented. Technical difficulties and limitations are identified. An objective oriented discussion completes the thesis, with the conclusion that the original hypothesis has been validated. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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