Chip Scale Package LED Beam Pattern Measurement and Simulation
| Autor: | Yuan-Lung Chou, 周遠龍 |
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| Rok vydání: | 2016 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 105 LED nowadays is usually packed by single-sided small white case. This paper is to discuss and compare the CSP LED which utilizes five sides to light with the small white case package. The volume of CSP LED is smaller and has four additional lateral sides to light that is a more efficient way to utilize the luminous efficiency. However, it is not discussed in details in general research regarding the luminous flux and the optical model distribution of the front side and lateral side. Therefore, the luminous flux and the optical model are measured separately for CSP LED’s front side and lateral side in this paper. And compare the luminous flux and the optical model for the front side and lateral side by experiment. The precise luminous model produced by the five sides of CSP LED is built successfully through this research, it will have positive helpfulness for the building and application of optical model in the future. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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