The Study on Heat-Dissipating Package Paints for Light-Emitting Diodes
| Autor: | Wei-Feng Teng, 鄧維豐 |
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| Rok vydání: | 2012 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 100 As electronic products constantly renovate, the appearance of the products trends to be light, thin, short, as well as small and their functions also direct to high applications, high communication, and high efficiencies. Therefore, the technology for thermal management in the whole process of product design is persistently important. For the applications of specific products, the pivotal step for device integration of thermal management design is the selection of optimal thermal interface material, promoting the heat-dissipating efficiencies of whole electronic products. In this study, reactive functional hybrid polymers with low contraction, high thermal dissipation, and high adhesion have been prepared by molecular structure design/modification of functional resins, prescription of initiators, and addition/modification of heat-dissipating powders. With the technology for functional prescription design, dispersion, and manipulation of curing speed, furthermore, we have also successfully manufactured thermal dissipating paints with surface resistance 1×109Ω/□~1010Ω/□, thermal conduction constant 11.36W/m.K, adhesion strength 19.45 kgf/cm2, and contraction rate 1.71％, establishing the self-research capabilities of key materials with high added value for domestic optoelectronic/electronic industries and enhancing the competitiveness for international markets. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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