The Dynamic Impact Behavior of Lead-free solders at elevated temperature
| Autor: | Ren-jie Lin, 林仁傑 |
|---|---|
| Rok vydání: | 2008 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 97 The mechanical properties of Sn63Pb37, SAC105 and SAC305 solders have been measured at high strain rates (1,000 ~ 3,000 s-1) using SHPB (split Hopkinson pressure bar) apparatus. Specimens were produced by quenching in air from the melt. Measurements were made at room temperature, 60 and 90 degrees Centigrade. For better accuracy, we utilized some techniques to decrease the effects caused by temperature rising. In order to find the stress exponents of solders, we measured the quasi-static properties of solder materials and use the results of both high and low strain rate tests to calculate the stress exponents. The results showed that the elevated temperatures had effect on the stress exponents of solders. The higher test temperature will cause the value of stress exponent down. In high strain rate tests (2,000 ~ 3,000 s-1), the Sn63Pb37, SAC105 and SAC305 solders all had obviously temperature dependency. Observing the stress exponents of solders characterized at 5 %, 10 %, 15 % and 20 % strain, we can find that the value of stress exponent will change with different strains. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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