Residual Stress as a Result of Microchip Packaging
| Autor: | Feng-Yeang Chung, 鍾豐仰 |
|---|---|
| Rok vydání: | 1999 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 87 Changes in stress and temperature caused by microchip packaging are studied. Piezoresistive strain gauges are fabricated onto a chip prior to packaging, and used to measure the resulting stress and temperature. A test bar is used to determine the piezoresistance coefficients and the temperature coefficients of resistivity of the wafer. Then the characterized strain gauges are used to measure the data. An algorithm for determining the orientation of the strain gauges is demonstrated. The test bar and chip are fabricated and tested. The piezoresistance coefficients and temperature coefficients of resistivity of the test bar, and the stress and temperature on the chip during packaging is obtained. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
|