High‐Q RF inductors on 20 Ω.cm silicon realized through wafer‐level packaging techniques
| Autor: | Carchon, G.J., De Raedt, W., Beyne, E. |
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| Zdroj: | Microelectronics International: An International Journal, 2003, Vol. 20, Issue 1, pp. 26-30. |
| Databáze: | Emerald Insight |
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