An experimental methodology for the study of co‐planarity variation effects in anisotropic conductive adhesive assemblies
| Autor: | Dou, Guangbin, Whalley, David C., Liu, Changqing, Chan, Y.C. |
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| Zdroj: | Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 1, pp. 47-55. |
| Databáze: | Emerald Insight |
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