Optimization of lead free solder 01005 component assembly

Autor:	Liu, Yueli, Wayne Johnson, R.
Zdroj:	Soldering & Surface Mount Technology, 2007, Vol. 19, Issue 1, pp. 15-27.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540910710748122 Zobrazit plný text záznamu