Diffusion barrier property of TiN and TiN/Al/TiN films deposited with FMCVD for Cu interconnection in ULSI
| Autor: | Shin, Young-Hoon ∗, Shimogaki, Yukihiro |
|---|---|
| Zdroj: | In Science and Technology of Advanced Materials 2004 5(4):399-405 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|